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Product name: Hollow Glass Microsphere/Glass Bubble
Hollow Glass Microsphere (HGM) is a kind of hollow spherical powder which is inorganic and non-metallic. It is a new kind of lightweight material with wide applications and excellent properties. Its true density is 0.1-0.6g/cm° and particle size is between 2-130fm. High performance hollow glass microspheres not only have low density, low thermal conductivity, and compressive strength. The advantages of high strength, good dispersibility, flowability, and chemical stability, as well as Excellent properties such as low dielectric, self-lubricating, soundproof, non absorbent, fire-resistant, corrosion-resistant, etc, Known as the 'space material of the new era. Hollow Glass Microsphere is widely used in coatings, rubber, plastics, glass steel. artificial stone atomic ash, emulsified explosives and oil and gas field mining industry products.
Prodcut Specifications
Model | True Density | Bulk Density | Crush Strength | Particle Size | Softening Point | Volumetric | Weight Ratio | pH Value | Moisture Content | Thermal Conductivity | ||
D10 | D50 | D90 | ||||||||||
KPM20 | 0.18-0.22 | 0.10-0.12 | 3.44/500 | 30 | 60 | 105 | 620 | ≥98 | ≥95 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM20HS | 0.194-0.206 | 0.10-0.12 | 5.17/750 | 25 | 55 | 90 | 620 | ≥99 | ≥96 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM22 | 0.19-0.25 | 0.11-0.13 | 3.44/500 | 25 | 55 | 90 | 620 | ≥98 | ≥95 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM25 | 0.23-0.27 | 0.12-0.15 | 5.17/750 | 25 | 55 | 90 | 620 | ≥98 | ≥95 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM25HS | 0.244-0.256 | 0.12-0.15 | 5.17/750 | 25 | 50 | 85 | 620 | ≥99 | ≥96 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM32 | 0.30-0.34 | 0.15-0.18 | 10/1450 | 25 | 55 | 80 | 620 | ≥98 | ≥94 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM32HS | 0.314-0.326 | 0.15-0.18 | 13.79/2000 | 25 | 45 | 75 | 620 | ≥99 | ≥95 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM38 | 0.36-0.40 | 0.18-0.20 | 28/4000 | 20 | 45 | 75 | 620 | ≥98 | ≥94 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM38HS | 0.374-0.386 | 0.18-0.20 | 42/6000 | 10 | 35 | 70 | 620 | ≥99 | ≥95 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM40 | 0.38-0.42 | 0.20-0.23 | 28/4000 | 10 | 35 | 75 | 620 | ≥98 | ≥94 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM40HS | 0.394-0.406 | 0.20-0.23 | 42/6000 | 10 | 30 | 60 | 620 | ≥99 | ≥95 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM46 | 0.44-0.48 | 0.23-0.26 | 42/6000 | 10 | 35 | 75 | 620 | ≥98 | ≥93 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM46HS | 0.454-0.466 | 0.24-0.27 | 69/10000 | 10 | 28 | 65 | 620 | ≥99 | ≥94 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM50 | 0.48-0.52 | 0.25-0.27 | 55/8000 | 15 | 35 | 60 | 620 | ≥98 | ≥92 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM60 | 0.58-0.62 | 0.30-0.34 | 69/10000 | 10 | 30 | 65 | 620 | ≥98 | ≥92 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM60S | 0.594-0.606 | 0.30-0.34 | 83/12000 | 10 | 30 | 60 | 620 | ≥98 | ≥92 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
KPM60HS | 0.594-0.606 | 0.32-0.36 | 97/14000 | 10 | 30 | 55 | 620 | ≥98 | ≥90 | 8.0-9.5 | ≤0.3 | 0.02 ~ 0.06 |
Applications suggestions
Application | Effects | Model | |
Aviation material | Aerospace Accessorie | Lightweight, Thermal insolution | KPM10, KPM15, KPM20 |
Aerospace adhesive | Lightweight, reduce shrink, reduce organic volatilization | KPM25, KPM32, KPM38, KPM40 | |
5G TecKPMology | Composite circuit board | Reduce permittivity | KPM46HS, KPM16K, KPM60HS, KPM18K |
Construction Materials | Thermal Insulation material | Thermal Insolution, reduce power consumption | KPM20, KPM25, KPM32, KPM38, KPM40, KPM46 |
Artificial Stone | Easy grind, polish, light anti overheat burst | KPM25, KPM32, KPM38, KPM40 | |
Tooling Board | Lightweight, wear resistant, enhance mechanical performance | KPM25, KPM32, KPM38, KPM40 | |
Norganic thermal Insolution material | Flameproof, thermo preservation | KPM20, KPM25 | |
Rubber | Polyurethane molding | Reduce production cost, easy moulding, polish, reduce shrink | KPM20, KPM25, KPM32, KPM38, KPM40, KPM46 |
Polyurethane materials | Reduce production cost, easy moulding, polish, reduce shrink | KPM20 | |
Plastic (Thermoplastic, Thermoset) | Reduce production cost, easy moulding, polish, reduce shrink | KPM32,KPM38, KPM40, KPM46, KPM60 | |
Injection molding, excrusion molding | Lightweight, enhance production efficiency, replace resin, stability enhance | KPM40, KPM46, KPM60 | |
Synthetic foam | reduce shrink, stability enhance | KPM20, KPM25,KPM32,KPM38,KPM40,KPM46,KPM60 | |
OilField | Oil well cementing | Light weight, enhance cement stability, eheology, filtration control | KPM40, KPM46, KPM60, KPM46HS,KPM16K, KPM60HS, KPM18K |
Low density drilling Fluid | Light weight, enhance cement stability, eheology, filtration control | KPM60, KPM60HS, KPM18K | |
Ocean | Deep sea insolution pipe | Solid reinforcement, thermo insolution | KPM40, KPM46, KPM60 |
Buoyancy material | Light weight, enhance stability, anti corrosion | KPM25, KPM32, KPM38, KPM40, KPM46, KPM60 | |
Special anti-corrision coating | Reduce cost, light weight, reduce shrink | KPM20, KPM32 | |
Automobile Vehicle | Interial&Exterial plastic parts | Light weight, durable modeling | KPM60HS, KPM18K |
Structural sealants | lightweight, easy disperse, heat insolution, noise cancellation, flameproof | KPM20HS, KPM38HS, KPM46HS, KPM 60 | |
Battery Pack glue | Lightweight, easy fill in, flameproof | KPM20HS, KPM38HS, KPM46HS, KPM 60 | |
Chassis Coating | Light weight, heat insolution, Noise cancellation, antifouling, anti corrosion, impulse resistant, no cracking | KPM16K |
Hollow glass microsphere KPM
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Contact
Mail: info@kpolychem.com
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